High-entropy materials, generally referring to the materials consisting of multiple elements with (nearly) equal concentrations, have attracted intense attention due to their excellent (e.g., mechanical, functional, and corrosion-resistant) properties that can lead to a wide range of engineering applications. But a number of challenges exist in high-entropy materials. For example, atomic-scale mechanisms associated with the properties of high-entropy materials remain elusive. To address these challenges, this workshop aims to gather worldwide leading experimental and theoretical experts to discuss and explore opportunities in this new frontier of materials science.
The registration fee includes five breakfasts and a BBQ picnic dinner.
We wish to ensure an intimate workshop setting, with no more than 20 to 25 participants. If you are interested in attending, but have not received an invitation, please contact the workshop organizer before registering.
TSRC is about expanding the frontiers of science, exploring new ideas, and building collaborations. The workshop schedule will allow for substantial unstructured time for participants to talk and think. All participants are expected to stay for the entire duration of the workshop. Scientists are encouraged to consider bringing family or friends. Telluride offers a number of options for children's camps (including Telluride Academy, Ah Haa School for the Arts, and Pinhead Institute). There is more information on childcare, camps, and family activities on TSRC's website at https://www.telluridescience.org/travel/families. Please contact Cindy Fusting at cindy@telluridescience.org for more information.
Telluride Intermediate School
725 West Colorado Ave
Telluride, CO 81435
| Participant | Organization | ||||
| Aidhy, Dilpuneet | University of Wyoming | ||||
| Baker, Ian | Thayer School of Engineering, Dartmouth College | ||||
| Chen, Wei | Illinois Institute of Technology | ||||
| Chen, Wen | University of Massachusetts Amherst | ||||
| Gao, Michael | National Energy Technology Laboratory | ||||
| Gianola, Daniel | UC Santa Barbara | ||||
| Hong, Qijun | Arizona State University | ||||
| Johnson, Duane | Iowa State University | ||||
| Karaman, Ibrahim | Texas A&M University, Department of Materials Science and Engineering | ||||
| Marian, Jaime | University of California Los Angeles | ||||
| Miracle, Dan | AF Research Laboratory | ||||
| Moridi, Atieh | Cornell University | ||||
| Oh, Hyunseok | Massachusetts Institute of Technology | ||||
| Pitike, Krishna Chaitanya | Pacific Northwest National Laboratory | ||||
| Poudeu, Pierre Ferdinand | University of Michigan | ||||
| Ravi, Vilupanur | California State Polytechnic University | ||||
| Rickman, Jeffrey | Lehigh University | ||||
| Rupert, Timothy | University of California, Irvine | ||||
| Selim, Farida | Bowling Green State University | ||||
| Terletska, Hanna | Middle Tennessee State University | ||||
| Vohra, Yogesh K. | University of Alabama at Birmingham | ||||
| Widom, Michael | Carnegie Mellon University | ||||
| Zhuang, Houlong | ARIZONA STATE UNIVERSITY | ||||